Mosaic Microsystems wins NSF Grant

InteliSpark client Mosaic Microsystems LLC, has been awarded a Phase I SBIR grant from the NSF for their project, “Manufacturable Implementation of Thin Glass for Next Generation Electronics Packaging”. The focus of this project will be on enabling processing thin glass substrates for next generation communications and packaging needs that will allow for faster communications with improved power efficiency.

There is an ever-expanding need for data, due to technologies such as mobile communications, cloud computing, the Internet of Things (IoT), and the shift of communication to higher frequencies. As the frequency increases, traditional material choices, such as silicon, can experience very high losses and therefore there is increasing interest in using insulating materials, such as glass, to improve power efficiency. Additionally, as device size is also important, ability to process thin materials is critical. Therefore, Mosaic Microsystems has set out to enable cost-effective processing of thin glass substrates and enable next generation communication initiatives impacting commercial, military and industrial markets.

There has been great interest in using glass for next generation RF and packing solutions for many years due to its advantageous material properties, and scalability. There has been a lot of progress in establishing processes to form thin glass and make precision through glass via (TGV), as well as demonstrated advantaged functional performance in a lab environment. However, there has been a challenge to establish the ability to scale to high volume for thin glass solutions due to gaps in the supply chain. Mosaic Microsystems will provide effort to establish a process that enables a carrier solution using a silicon carrier that will allow processing of glass in existing infrastructure making thing glass solutions available to the current well established and capable supply chain.